Flawless Accuracy

Thin wafer dicing with extremely high processing quality, that is what customers have come to expect from GDSI.

Dicing is the process by which individual silicon chips or integrated circuits on a silicon wafer are separated following the processing of the wafer. By utilizing fully automated K&S 7500 dicing saws, GDSI can develop the optimal dicing process for your specific application.

Capabilities

  • Full/Partial Wafer Dicing

    GDSI

    Full/Partial Wafer Dicing

    Over the course of 15 years, GDSI has been asked to dice a wide array of substrates. As the industry evolves, we can leverage our deep technical knowledge of proper feed rate, blade and tape selection in meeting future requests. GDSI carries an extensive library of semiconductor-grade tape aimed at grinding,polishing and dicing. Ask us for a recommendation!

    • Any Size or Shape < 8"
    • Die Level Dicing
  • High Complexity

    GDSI

    High Complexity

    In order to reduce mask set costs, multi-project wafers are commonplace. GDSI can effectively dice your MPW. We can control the key variables which may impact the outcome of a particular dicing process. Control is paramount whether you require a specific cut depth (Z-axis control), traceability or an elaborate MPW saw plan. Further, GDSI can singulate PCB's.

    Do you have an odd dicing requirement? GDSI has probably already done it. Call to find out.

    • Multi-project Wafers
    • Die Level Traceability
    • Step Cutting
    • Depth Controlled Cuts
    • Multi-blade Cuts
  • High Throughput

    GDSI

    High Throughput

    Each saw has a cassette loading system, auto-alignment as well as an integrated cleaning station. This increases wafer throughput and yields a wafer that does not require an additional cleaning step.

  • Final Packaging

    GDSI

    Final Packaging

    Wafers that have been diced can be shipped in several configurations. The most popular is to continue the process through pick & place and ship die in waffle packs. Another common alternative is to have the wafer stretched to a hoop or grip ring and placed into a "pizza box" for shipment. If you do not like these options, call us to discuss your particular requirement.

  • Specifications

    GDSI

    Typical Specifications

    Topside chipout < 10 microns
    Backside chipout < 25 microns
    Final Die Size Tolerance +/- 25 microns

    For some applications GDSI has been able to develop processes to meet specifications at less than half the numbers above.

Allow GDSI to process your wafer to singulated form by utilizing our pick and place and auto inspection services

Equipment

  • 3 Kulicke & Soffa Saws
  • 2 August Auto Inspection Tools
  • 3 Laurier DS 4000 Pick & Place Tools