The versatility of our inspection systems allows us to inspect any repeating die on substrates up to 8" in diameter. The sensitivity of the system can be altered to pick up or ignore virtually anything of interest as small as 2 microns. We have enhanced our tools with both Solder Ball and Bond Pad inspection functions. You may find our content rich reports useful in identification of wafer fabrication process flaws.
Commercial inspection standards is the norm. In reality, GDSI customers furnish us with their custom specification document which we adhere to carefully. We can also handle your critical die in accordance with Military Standard 883 or "Mil 883".
The automated inspection system can directly import electrical test data, which saves us time and you money. By importing this data the tool can identify the die that need inspection and those that do not.
As a useful byproduct of the automated inspection process, the final results of the inspection system can be exported as a colorful wafermap. Die yield and reject bins are given unique colors, which can aid in the isolation of fabrication issues.
Allow GDSI to take your thinned wafer all the way to singulated die form by utilizing our grinding, polishing, dicing and pick & place services.