Service Request Form

Customer Information

Company name:
Contact name:
Desk phone:
Cell phone:
e-mail:
Date:
PO:
Incoming Material
P/N Lot #
# of Wafers
Type of service requested
Grinding Polishing
Pick & Place Dicing
Inspection (auto or manual)

Wafer Information

What is the wafer size?:
Please choose substrate type::
Is this a production wafer? No
Is this a unpatterned wafer? Yes No
Is this a bumped wafer? Yes No
Are there metals , passivation, or protective films? Yes No

Process Details

Dicing
X-index (um)
Street width (um)
Y-index (um)
Max die chip-out (um):
 
Final Die Dimensions  
length (um):
width (um):
* If this is a MPW, please provide:
Reticule layout, Dicing Plan, Die dimensions, Die view
 
For Dice-only Jobs
Tape type:
Nitto Blue UV Tape Other
Frame Format:
Stretched to Hoop
On Dicing Frame
 
Grinding/Polishing
Final Target Final TTV
Thickness: Requirement:

Shipping/Inspection Details

Automated High Level Inspection
Mil-Std-883
Commercial Grade
* Please attach special details to this request
 
Manual Inspection
100% Inspection
Sample Inspection
No Inspection
ITAR Required
 
Pick & Place
Gel Pak
Waffle Pack
Customer Supplied
 
Packaging
Please inquire about special requirements
1. Wafer skins, polished wafers, or ground wafers will be shipped in wafer jars.
2. Wafers on dicing rings or on hoops will be shipped in film frame shippers or in wafer jars as determined by size.
Shipping Information
Contact:
Address:
Address Line2
City:
State: Zip:
Delivery Information
Delivery service:
Priority:
Account number:
Upload File:
Security Code: