408-451-2000 Home   Media   Request Form   Contact   Customer Information Company name: Contact name: Desk phone: Cell phone: e-mail: Date: PO: Incoming Material P/N Lot # # of Wafers Type of service requested Grinding Polishing Pick & Place Dicing Inspection (auto or manual)   Wafer Information What is the wafer size?: Please choose substrate type:: Si SiGe SiC Glass FR4 GaAs InP LiTaO3 Package GaN Other Is this a production wafer? Yes No Is this a unpatterned wafer? Yes No Is this a bumped wafer? Yes No Are there metals , passivation, or protective films? Yes No   Process Details Dicing X-index (um) Street width (um) Y-index (um) Max die chip-out (um):   Final Die Dimensions   length (um): width (um): * If this is a MPW, please provide: Reticule layout, Dicing Plan, Die dimensions, Die view   For Dice-only Jobs Tape type: Nitto Blue UV Tape Other Frame Format: Stretched to Hoop On Dicing Frame   Grinding/Polishing Final Target Final TTV Thickness: Requirement: Shipping/Inspection Details Automated High Level Inspection Mil-Std-883 Commercial Grade * Please attach special details to this request   Manual Inspection 100% Inspection Sample Inspection No Inspection ITAR Required   Pick & Place Gel Pak Waffle Pack Customer Supplied   Packaging Please inquire about special requirements 1. Wafer skins, polished wafers, or ground wafers will be shipped in wafer jars. 2. Wafers on dicing rings or on hoops will be shipped in film frame shippers or in wafer jars as determined by size.   Shipping Information Contact: Address: Address Line2 City: State: Zip: Delivery Information Delivery service: Priority: Account number: Upload File:     Wafer Grinding & Polishing | Wafer Automated Inspection | Wafer Dicing Wafer | Pick & Place | Media | ISO 9001:2008 | Sitemap GDSI © 2011 Designed by: