Media

News

GDSI Announces Scott Sullivan as Chief Technologist

Posted Oct 10th, 2017

SAN JOSE, Calif., Aug. 22, 2017 /PRNewswire/ -- Grinding & Dicing Services Incorporated ("GDSI") is pleased to announce that Scott Sullivan has recently joined our team as Chief Technologist, reporting to the President.

"I have followed Scott throughout his career, soliciting his opinion on vexing technical problems or asking for his read on emerging technologies which could benefit GDSI customers. Scott always had great insight. GDSI fully intends on utilizing his talents as we engage our employees, customers and suppliers," said Joe Collins, President of GDSI. "The MEMS market has entered a growth phase and along with that come several complex manufacturing challenges. Similarly, advanced packaging developments have created technical hurdles for processing ultrathin wafers which is GDSI's core competency. Scott has worked industry leaders, identifying technological gaps while finding practical solutions. We expect he will lead GDSI and its customers in a similar manner."

Prior to joining GDSI, Sullivan was the Chief Technologist at DISCO Hi-Tec America for 14 years. He also was a business development manager at ESI on laser cutting and Suss MicroTec for temporary wafer bonding.

"I am excited to join the team at GDSI and look forward to working with a wide variety of customers who help to bring new and innovative products to the world," said Sullivan. "I have collaborated with GDSI over the years, watching it evolve into a best of breed supplier who enables their customers for product realization. I hope to contribute towards the continued success of GDSI."

Grinding & Dicing Services Incorporated

Founded in the Silicon Valley in 1992, GDSI stands tall as the premier wafer thinning and dicing subcontractor available to industry. GDSI teams with some of the most advanced research and development groups in the world on a variety of leading edge IC technologies. We offer an approved, secure environment for Multi-reticle, prototype, and low-mid volume production wafers. In addition to our Quality Management System ("QMS") which governs all phases of our process flow, GDSI has the requisite staff and control plans to ensure strict compliance with Trusted program details. GDSI is ITAR and ISO registered. For additional information regarding our suite of services, please visit our website at www.wafergrind.com.

Contact: Joe Collins, President (408-961-3720) or jcollins@wafergrind.com

GDSI receives "Trusted Foundry" supplier ranking from US DoD

Posted Oct 10th, 2017

GDSI provides unrivaled wafer grinding and dicing support for both MIL-AERO and commercial programs, delivering high yields & tight tolerances for complex die preparation activities.

SAN JOSE, Calif., Aug. 2, 2017 /PRNewswire/ -- GDSI, a privately held US-based subcon, encourages all interested buyers to engage in discussion regarding potential programs carrying either a Trusted Supplier requirement or similar requirement for processing of sensitive materials. A key part of the DoD Trusted Foundry program is that it uniquely provides the US Government with access to leading edge, Trusted microelectronics services for low & high-volume needs. Foundry services may encompass multi-project wafer runs, dedicated prototypes, and production models of varying volumes.

Grinding & Dicing Services Incorporated

Founded in the Silicon Valley in 1992, GDSI stands tall as the premier wafer thinning and dicing subcontractor available to industry. GDSI teams with some of the most advanced research and development groups in the world on a variety of leading edge IC technologies. We offer an approved, secure environment for Multi-reticle, prototype, and low-mid volume production wafers. In addition to our Quality Management System ("QMS") which governs all phases of our process flow, GDSI has the requisite staff and control plans to ensure strict compliance with Trusted program details. GDSI is ITAR and ISO registered. For additional information regarding our suite of services, please visit our website at www.wafergrind.com.

Contact: Joe Collins, President (408-961-3720) or jcollins@wafergrind.com

Rockwell Collins presents Grinding & Dicing Services Incorporated ("GDSI") with ASIC Supplier of the Year Award

Posted May 5th, 2010

Cedar Rapids, Iowa (April 15, 2010) – Grinding and Dicing Services Inc. of San Jose, CA., was presented with the 2010 ASIC Supplier of the Year Award by Jeff Moore, Senior Vice President of Operations Rockwell Collins, during the company’s Annual Supplier Conference.

About GDSI: GDSI is a leading supplier to the IC industry for critical post-fabrication process requirements.

Posted February 14th, 2007

GDSI is a leading supplier to the IC industry for critical post-fabrication process requirements. Based in the heart of the Silicon Valley, GDSI continues to flourish after 15 years of industry experience. As a key supply chain consultant, we grow with you from prototype to production levels.

ITAR Registration

Posted January 5th, 2007

San Jose, CA. GDSI has received ITAR registration from the United States Department of State. For practical purposes, ITAR regulations dictate that information and material pertaining to defense and military related technologies may only be shared with US Persons unless approval from the Department of State is received or a special exemption is used.

GDSI confirms it has achieved ISO 9001: 2008 Certification

Posted April 24th, 2006

San Jose, CA. GDSI confirms it has achieved ISO 9001: 2008 Certification through their relationship with its registrar, Underwriters Laboratories, Inc. (UL). Joe Collins, President & CEO of GDSI, stated that "the certification affirms the premium which we place on quality on behalf our customers’ sensitive products and allows our Quality Management System to stand the rigors of an external audit".

GDSI has announced the installation of their second NSX 95 automated defect inspection tool targeting macro defects.

Posted October 1st, 2005

San Jose, CA. GDSI has announced the installation of their second NSX 95 automated defect inspection tool targeting macro defects. The NSX® Series is a proven high-throughput and repeatable macro defect inspection solution used throughout the device manufacturing process. Macro defects (defects 0.5 micron and larger) can be created during wafer manufacturing, probing, bumping, dicing, or by general handling, and can have a major impact on the quality of a microelectronic device.