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Rockwell Collins presents Grinding & Dicing Services Incorporated ("GDSI") with ASIC Supplier of the Year Award

Posted May 5th, 2010

Cedar Rapids, Iowa (April 15, 2010) – Grinding and Dicing Services Inc. of San Jose, CA., was presented with the 2010 ASIC Supplier of the Year Award by Jeff Moore, Senior Vice President of Operations Rockwell Collins, during the company’s Annual Supplier Conference.

About GDSI: GDSI is a leading supplier to the IC industry for critical post-fabrication process requirements.

Posted February 14th, 2007

GDSI is a leading supplier to the IC industry for critical post-fabrication process requirements. Based in the heart of the Silicon Valley, GDSI continues to flourish after 15 years of industry experience. As a key supply chain consultant, we grow with you from prototype to production levels.

ITAR Registration

Posted January 5th, 2007

San Jose, CA. GDSI has received ITAR registration from the United States Department of State. For practical purposes, ITAR regulations dictate that information and material pertaining to defense and military related technologies may only be shared with US Persons unless approval from the Department of State is received or a special exemption is used.

GDSI confirms it has achieved ISO 9001: 2008 Certification

Posted April 24th, 2006

San Jose, CA. GDSI confirms it has achieved ISO 9001: 2008 Certification through their relationship with its registrar, Underwriters Laboratories, Inc. (UL). Joe Collins, President & CEO of GDSI, stated that "the certification affirms the premium which we place on quality on behalf our customers’ sensitive products and allows our Quality Management System to stand the rigors of an external audit".

GDSI has announced the installation of their second NSX 95 automated defect inspection tool targeting macro defects.

Posted October 1st, 2005

San Jose, CA. GDSI has announced the installation of their second NSX 95 automated defect inspection tool targeting macro defects. The NSX® Series is a proven high-throughput and repeatable macro defect inspection solution used throughout the device manufacturing process. Macro defects (defects 0.5 micron and larger) can be created during wafer manufacturing, probing, bumping, dicing, or by general handling, and can have a major impact on the quality of a microelectronic device.