GDSI

Full/Partial Wafer Dicing

Since 1992 GDSI has been asked to dice a wide array of substrates. As the industry evolves, we can leverage our deep technical knowledge of proper feed rate, blade and tape selection in meeting future requests. GDSI carries an extensive library of semiconductor-grade tape aimed at grinding,polishing and dicing. Ask us for a recommendation!

GDSI

High Complexity

In order to reduce mask set costs, multi-project wafers are commonplace. GDSI can effectively dice your MPW. We can control the key variables which may impact the outcome of a particular dicing process. Control is paramount whether you require a specific cut depth (Z-axis control), traceability or an elaborate MPW saw plan. Further, GDSI can singulate PCB's.

Do you have an odd dicing requirement? GDSI has probably already done it. Call to find out.

GDSI

High Throughput

Each saw has a cassette loading system, auto-alignment as well as an integrated cleaning station. This increases wafer throughput and yields a wafer that does not require an additional cleaning step.

GDSI

Final Packaging

Wafers that have been diced can be shipped in several configurations. The most popular is to continue the process through pick & place and ship die in waffle packs. Another common alternative is to have the wafer stretched to a hoop or grip ring and placed into a "pizza box" for shipment. If you do not like these options, call us to discuss your particular requirement.

GDSI

Typical Specifications

Topside chipout < 10 microns
Backside chipout < 25 microns
Final Die Size Tolerance +/- 25 microns

For some applications GDSI has been able to develop processes to meet specifications at less than half the numbers above.